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1. (WO2017039861) RADIO FREQUENCY MICRO-ELECTROMECHANICAL SYSTEMS HAVING INVERTED MICROSTRIP TRANSMISSION LINES AND METHOD OF MAKING THE SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/039861 International Application No.: PCT/US2016/043282
Publication Date: 09.03.2017 International Filing Date: 21.07.2016
IPC:
B81B 7/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
7
Micro-structural systems
Applicants:
GENERAL ELECTRIC COMPANY [US/US]; 1 River Road Schenectady, NY 12345, US
Inventors:
LEE, Yongjae; US
IANNOTTI, Joseph, Alfred; US
KEIMEL, Christopher, Fred; US
KAPUSTA, Christopher, James; US
Agent:
DIMAURO, Peter, T.; US
WINTER, Catherine, J.; US
GNIBUS, Michael, M.; US
CONKLIN, Mark, A.; US
KRAMER, John, A.; US
Priority Data:
14/839,46428.08.2015US
Title (EN) RADIO FREQUENCY MICRO-ELECTROMECHANICAL SYSTEMS HAVING INVERTED MICROSTRIP TRANSMISSION LINES AND METHOD OF MAKING THE SAME
(FR) SYSTÈMES MICRO-ÉLECTROMÉCANIQUES À RADIO-FRÉQUENCE AYANT DES LIGNES DE TRANSMISSION À MICRO-RUBAN INVERSÉES ET LEUR PROCÉDÉ DE FABRICATION
Abstract:
(EN) A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
(FR) Boîtier à système micro-électromécanique (MEMS) à radio-fréquence (RF) comprenant un premier substrat de montage, une ligne de signal formée sur une surface supérieure du premier substrat de montage, la ligne de signal comprenant un dispositif MEMS couplant électriquement de manière sélective une première partie de la ligne de signal à une seconde partie de la ligne de signal, et un ensemble de mise à la terre couplé au premier substrat de montage. L'ensemble de mise à la terre comprend un second substrat de montage, un plan de masse formé sur une surface inférieure du second substrat de montage, et au moins une interconnexion électrique s'étendant à travers une épaisseur du second substrat de montage pour entrer en contact avec le plan de masse, le plan de masse étant espacé de la ligne de signal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)