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1. (WO2017039790) TRACE ANYWHERE INTERCONNECT

Pub. No.:    WO/2017/039790    International Application No.:    PCT/US2016/038687
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Jun 23 01:59:59 CEST 2016
IPC: H01R 12/00
B33Y 80/00
H01L 23/522
H01L 23/535
H01R 13/02
H05K 1/14
H05K 3/36
Applicants: R&D CIRCUITS, INC.
Inventors: WARWICK, Thomas, P.
TURPUSEEMA, Dhananjaya
RUSSELL, James, V.
Title: TRACE ANYWHERE INTERCONNECT
Abstract:
The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side