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1. (WO2017039628) INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING

Pub. No.:    WO/2017/039628    International Application No.:    PCT/US2015/047811
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Tue Sep 01 01:59:59 CEST 2015
IPC: H01L 25/065
H01L 25/18
Applicants: INTEL CORPORATION
Inventors: SOBIESKI, Daniel
DARMAWIKARTA, Kristof
BOYAPATI, Sri Ranga Sai
CELIKKOL, Merve
LEE, Kyu Oh
AYGUN, Kemal
QIAN, Zhiguo
Title: INORGANIC INTERPOSER FOR MULTI-CHIP PACKAGING
Abstract:
Discussed generally herein are methods and devices for multichip packages that include an inorganic interposer. A device can include a substrate including low density interconnect circuitry therein, an inorganic interposer on the substrate, the inorganic interposer including high density interconnect circuitry electrically connected to the low density interconnect circuitry, the inorganic interposer including inorganic materials, and two or more chips electrically connected to the inorganic interposer, the two or more chips electrically connected to each other through the high density interconnect circuitry.