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1. (WO2017039624) METHOD OF FORMING A VIA OPENING

Pub. No.:    WO/2017/039624    International Application No.:    PCT/US2015/047795
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Tue Sep 01 01:59:59 CEST 2015
IPC: H01L 21/60
H01L 23/48
Applicants: INTEL CORPORATION
Inventors: MAY, Robert Alan
SHISHODIA, Vikram
BOYAPATI, Sri Ranga Sai
Title: METHOD OF FORMING A VIA OPENING
Abstract:
Some example forms relate to a method of forming a via opening in an electric component. The method includes inserting a desmearing agent into a via opening to remove smear from the via opening. The desmearing agent includes a first species which forms radicals when coming into contact with a conductor within the via opening. The radical activates an inactive second species to form an active second species that is part of the desmearing agent. The active second species converts smear to solubilized reaction products within the via opening. The method further includes rinsing the via opening to remove the desmearing agent and the solubilized reaction products from the via opening.