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1. (WO2017039402) METHOD FOR PRODUCING ALLOY THIN FILMS OF VARIOUS COMPOSITIONS BY MEANS OF ELECTROFORMING
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Pub. No.: WO/2017/039402 International Application No.: PCT/KR2016/009877
Publication Date: 09.03.2017 International Filing Date: 02.09.2016
IPC:
C25D 1/04 (2006.01) ,C25D 1/00 (2006.01) ,C25D 3/12 (2006.01) ,C25D 3/38 (2006.01) ,C25D 5/10 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/14 (2006.01) ,C25D 5/18 (2006.01) ,C25D 5/50 (2006.01) ,C25D 7/06 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
04
Wires; Strips; Foils
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
12
of nickel or cobalt
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
38
of copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
14
two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
18
Electroplating using modulated, pulsed or reversing current
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
06
Wires; Strips; Foils
Applicants:
단국대학교 천안캠퍼스 산학협력단 DANKOOK UNIVERSITY CHEONAN CAMPUS INDUSTRY ACADEMIC COOPERATION FOUNDATION [KR/KR]; 충청남도 천안시 동남구 단대로 119 119, Dandae-ro, Dongnam-gu, Cheonan-si, Chungcheongnam-do 31116, KR
Inventors:
최용 CHOI, Yong; KR
Agent:
특허법인 이상 E-SANG PATENT & TRADEMARK LAW FIRM; 서울시 서초구 양재동 바우뫼로 188 188, Baumoe-ro, Seocho-gu, Seoul 06747, KR
Priority Data:
10-2015-012420902.09.2015KR
Title (EN) METHOD FOR PRODUCING ALLOY THIN FILMS OF VARIOUS COMPOSITIONS BY MEANS OF ELECTROFORMING
(FR) PROCÉDÉ DE PRODUCTION DE FILMS MINCES D'ALLIAGE DE DIVERSES COMPOSITIONS AU MOYEN D'UN ÉLECTROFORMAGE
(KO) 전주를 이용한 다양한 조성의 합금 박막 제조 방법
Abstract:
(EN) Disclosed is a method for producing various alloy thin films having desired compositions and controlled nanoscale cracks therein by means of an ultrasonic pulse electroforming process. Said method comprises the steps of: forming multi-layers comprising two or more different metallic thin-film layers having therein nanoscale cracks, which are caused by hydrogen, controlled; controlling, by pulse application, the thickness of the multi-layers on a nanoscopic scale and the number of the multi-layers so as to ultimately promote interdiffusion and control the multi-layers to have desired alloy compositions through heat treatment; and heat-treating the multi-layers so that the interdiffusion between the two or more different metallic thin-film layers is sufficiently generated. The heat treatment step is carried out together with rolling, thereby removing ultrafine cracks by compression and thus economically producing alloy foils having various compositions. The number and thickness of the multi-layers may be controlled in terms of a nanoscale thickness through the application of various kinds of pulses or controlled by serially connecting multiple electrolytic cells and moving/introducing an electroforming layer to the multiple electrolytic cells in stages or repeatedly under the condition of direct current application.
(FR) L'invention concerne un procédé de production de divers films minces d'alliage possédant des compositions souhaitées et des fissures régulées à l'échelle nanométrique en leur sein au moyen d'un processus d'électroformage à impulsions ultrasoniques. Ledit procédé comprend les étapes de : formation de couches multiples comprenant deux couches de film métallique mince différentes ou plus comportant en leur sein des fissures à l'échelle nanométrique, qui sont provoquées par l'hydrogène, celles-ci étant régulées; la régulation, par application d'impulsions, de l'épaisseur des couches multiples à une échelle nanoscopique et du nombre de couches multiples de façon à promouvoir en fin de compte l'interdiffusion et la régulation des couches multiples pour avoir les compositions d'alliage souhaitées par le biais d'un traitement thermique; et le traitement thermique des couches multiples de sorte que l'interdiffusion entre les deux couches de film métallique mince différentes ou plus est suffisamment produite. L'étape de traitement thermique est effectuée conjointement avec un laminage, ce qui permet d'éliminer les fissures ultrafines par compression et de produire ainsi économiquement des feuilles d'alliage ayant diverses compositions. Le nombre et l'épaisseur des couches multiples peuvent être régulés en termes d'épaisseur à l'échelle nanométrique par le biais de l'application de divers types d'impulsions ou régulés en connectant en série plusieurs cellules électrolytiques et en déplaçant/introduisant une couche d'électroformage aux multiples cellules électrolytiques en étapes ou de manière répétée sous la condition d'application de courant continu.
(KO) 초음파 펄스 전주 공정을 이용한 내부에 나노 크기의 균열이 제어된 원하는 조성의 다양한 합금 박막을 제조하는 방법이 개시된다. 이는 내부에 수소에 의한 나노크기의 균열의 제어된 2개 이상의 다른 금속 박막층을 포함하는 다중층을 형성하는 단계와, 펄스 인가로써 다중층의 두께를 나노크기로 제어하고 다중층의 갯수를 조절하여 궁극적으로 상호확산을 촉진 시키고 열처리를 통하여 원하는 합금조성으로 제어 할 수 있는 단계와, 2개 이상의 다른 금속 박막층 간에 상호 확산이 충분히 일어나도록 다중층을 열처리하는 단계를 포함한다. 열처리하는 단계는 압연을 병행하면서 수행하여 극미세 균열의 압착에 의한 제거와 그럼으로써 경제적으로 다양한 조성을 가지는 합금 포일을 제조할 수 있다. 다중층의 층 개수와 두께의 제어는 다양한 종류의 펄스 인가를 통하여 나노 크기의 두께로 제어하거나, 또는 다수의 전해조를 직렬 연결하고 직류 인가 조건에서 전주층을 상기 다수의 전해조들에 단계적 또는 반복적으로 이동 투입시켜서 제어하는 것일 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)