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1. (WO2017039176) LASER PROCESSING APPARATUS AND METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/039176 International Application No.: PCT/KR2016/008892
Publication Date: 09.03.2017 International Filing Date: 12.08.2016
IPC:
B23K 26/0622 (2014.01) ,B23K 26/00 (2014.01) ,B23K 26/06 (2014.01) ,B23K 26/064 (2014.01) ,G02B 6/42 (2006.01) ,H01S 3/00 (2006.01) ,B23K 103/00 (2006.01)
[IPC code unknown for B23K 26/0622]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
[IPC code unknown for B23K 26/064]
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
3
Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
Applicants:
(주)이오테크닉스 EO TECHNICS CO.,LTD. [KR/KR]; 경기도 안양시 동안구 동편로 91 91, Dongpyeon-ro Dongan-gu, Anyang-si, Gyeonggi-do 13930, KR
Inventors:
김남성 KIM, Nam Seong; KR
김기혁 KIM, Ki Hyuck; KR
김성훈 KIM, Seong Hoon; KR
권혁철 KWON, Hyuk Chul; KR
문승환 MUN, Seung Hwan; KR
Agent:
리앤목 특허법인 Y.P.LEE, MOCK & PARTNERS; 서울시 강남구 언주로 30길 13 대림아크로텔 12층 12F Daelim Acrotel, 13 Eonju-ro 30-gil Gangnam-gu, Seoul 06292, KR
Priority Data:
10-2015-012209128.08.2015KR
Title (EN) LASER PROCESSING APPARATUS AND METHOD
(FR) APPAREIL ET PROCÉDÉ DE TRAITEMENT AU LASER
(KO) 레이저 가공장치 및 방법
Abstract:
(EN) A laser processing apparatus and method are disclosed according to exemplary embodiments. According to the embodiments, provided is a laser processing apparatus comprising: a laser light source which emits a pulse laser; and an optical modulator which shields parts of a laser pulse wave having a laser intensity lower than a predetermined threshold and transmits parts of the laser pulse wave above the predetermined threshold to modulate the shape of the laser pulse.
(FR) Des modes de réalisation illustratifs de l'invention concernent un appareil et un procédé de traitement au laser. Selon les modes de réalisation, l'invention concerne un appareil de traitement au laser comprenant : une source de lumière laser qui émet un laser à impulsions ; et un modulateur optique qui bloque des parties d'une onde d'impulsion laser ayant une intensité laser inférieure à un seuil prédéterminé et transmet des parties de l'onde d'impulsion laser au-dessus d'un seuil prédéterminé pour moduler la forme de l'impulsion laser.
(KO) 예시적인 실시예들에 따르면, 레이저 가공장치 및 방법이 개시된다. 실시예들에 따르면, 펄스 레이저를 방출하는 레이저 광원 및 상기 레이저 펄스파에서 레이저 강도가 소정의 임계치보다 낮은 부분은 차폐하고 상기 소정의 임계치보다 높은 부분은 통과시킴으로써 상기 레이저 펄스의 모양을 변조하는 광 변조기를 포함하는 레이저 가공장치가 제공된다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)