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1. (WO2017039171) LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

Pub. No.:    WO/2017/039171    International Application No.:    PCT/KR2016/008840
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Aug 12 01:59:59 CEST 2016
IPC: B23K 26/02
B23K 26/03
B23K 26/04
B23K 26/046
B23K 26/06
B23K 26/08
Applicants: EO TECHNICS CO.,LTD.
(주)이오테크닉스
Inventors: LEE, Dong Jun
이동준
HYUN, Dong Won
현동원
KIM, Byung Oh
김병오
Title: LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Abstract:
Disclosed are a laser processing device and a laser processing method. The disclosed laser processing device comprises: a measuring device which measures a change in the height of a subject to be processed, and comprises a first light source, a first light focusing unit, a light sensing unit and a calculation unit, the first light source emitting a probe light for measurement, the first light focusing unit focusing the probe light and irradiating same on the subject to be processed, the light sensing unit comprising a Shack-Hartmann sensor and detecting a change in a reflected light which is the probe light being reflected from a reflective surface of the subject to be processed, and the calculation unit calculating a change in the height of the subject to be processed by using the change in the reflected light detected by the light sensing unit; a second light source which emits, on the subject to be processed, a laser light for processing; and a focus adjusting device which adjusts the focus of the laser light irradiated on the subject to be processed by using the change in the height of the subject to be processed measured by the measuring device.