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1. (WO2017039159) LOW TEMPERATURE CURING COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/039159 International Application No.: PCT/KR2016/008430
Publication Date: 09.03.2017 International Filing Date: 01.08.2016
IPC:
C08G 77/04 (2006.01) ,C08G 59/30 (2006.01) ,C08L 83/04 (2006.01) ,C08L 63/00 (2006.01) ,C09D 183/04 (2006.01) ,C09D 163/00 (2006.01) ,H01L 51/50 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
22
Di-epoxy compounds
30
containing atoms other than carbon, hydrogen, oxygen, and nitrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
183
Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
04
Polysiloxanes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
163
Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
Applicants:
삼성에스디아이 주식회사 SAMSUNG SDI CO., LTD. [KR/KR]; 경기도 용인시 기흥구 공세로 150-20 150-20 Gongse-ro, Giheung-gu, Yongin-si, Gyeonggi-do 17084, KR
Inventors:
송두리 SONG, Doori; KR
김우한 KIM, Woo Han; KR
신동주 SHIN, Dongju; KR
유홍정 YU, Hong Jeong; KR
이지호 LEE, Jiho; KR
Agent:
팬코리아특허법인 PANKOREA PATENT AND LAW FIRM; 서울시 강남구 논현로85길 70, 13층 13F, 70 Nonhyeon-ro 85-gil, Gangnam-gu, Seoul 06234, KR
Priority Data:
10-2015-012299131.08.2015KR
Title (EN) LOW TEMPERATURE CURING COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM
(FR) COMPOSITION DURCISSANT À BASSE TEMPÉRATURE, FILM DURCI FORMÉ DESSUS, ET DISPOSITIF ÉLECTRONIQUE PRÉSENTANT LE FILM DURCI
(KO) 저온 경화 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치
Abstract:
(EN) Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, the composition comprising: (A) an epoxy group-containing siloxane compound represented by the following chemical formula 1 [chemical formula 1] (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2 (in chemical formula 1, each of R1 to R9 are, independently, an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0≤M<1, 0≤D1<1, 0
(FR) La présente invention concerne une composition durcissant à basse température, un film durci obtenu par durcissement de la composition, et un dispositif électronique comprenant le film durci, la composition comprenant : (A) un composé siloxane contenant un groupe époxy représenté par la formule chimique 1 [formule chimique 1] (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2 (dans la formule chimique 1, chacun de R1 à R9 sont, indépendamment, un groupe organique indépendamment sélectionné parmi un groupe hydrocarbure aliphatique monovalent substitué ou non substitué de C1 à C6, un groupe hydrocarbure cycloaliphatique monovalent substitué ou non substitué de C6 à C20, un groupe hydrocarbure aromatique monovalent substitué ou non substitué de C6 à C20, et un groupe organique monovalent substitué par un groupe époxy, au moins l’un de R1 à R6 est un groupe organique monovalent substitué par un groupe époxy, 0 ≤ M < 1, 0 ≤ D1 < 1, 0 < T1 ≤ 1, 0 ≤ D2 < 1, 0 ≤ T2 < 1, et M + D1 + T1 + D2 + T2 = 1, où chacun des motifs structurels représentés par M, D1, T1, D2, et T2 peut comprendre un ou plusieurs types de motifs structurels différents) ; et (B) un initiateur thermique cationique pour une réaction d’ouverture de cycle d’époxyde, l’initiateur étant un sel d’un cation à base de sulfonium et d’un anion à base de borate, le composé représenté par la formule chimique 1 étant une combinaison d’un composé siloxane dont un poids moléculaire moyen en nombre se situe dans une plage de 100 à 1 000 et un composé siloxane dont un poids moléculaire moyen en nombre se situe dans une plage de 1 000 à 10 000.
(KO) (A) 하기 화학식 1로 표시되는 에폭시기 함유 실록산 화합물: [화학식 1] (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2 (화학식 1에서, R1 내지 R9는, 각각 독립적으로, 치환 또는 비치환된 C1 내지 C6의 1가 지방족 탄화수소기, 치환 또는 비치환된 C6 내지 C20의 1가 지환족 탄화수소기, 치환 또는 비치환된 C6 내지 C20의 1가 방향족 탄화수소기, 및 에폭시-치환된 1가 유기기로부터 독립적으로 선택되는 유기기이되, R1 내지 R6 중 적어도 하나는 에폭시-치환된 1가 유기기이고, 0≤M<1, 0≤D1<1, 0
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)