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1. (WO2017038954) EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRICAL/ELECTRONIC COMPONENT

Pub. No.:    WO/2017/038954    International Application No.:    PCT/JP2016/075727
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Sep 02 01:59:59 CEST 2016
IPC: C08G 59/24
C07D 301/28
C07D 303/27
C08G 59/40
C08L 63/00
Applicants: MITSUBISHI CHEMICAL CORPORATION
三菱ケミカル株式会社
Inventors: OOTA Kazumasa
太田 員正
Title: EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRICAL/ELECTRONIC COMPONENT
Abstract:
The present invention relates to a tetramethyl biphenolic epoxy resin represented by formula (1), and relates to an epoxy resin which has excellent solubility in a solvent and contains a small amount of hydrolyzable chlorine, while having an adequate melt viscosity, and which is especially suitable for use in a semiconductor sealing material and an electrical/electronic component such as a laminate. (In formula (1), n represents an integer of 0-10.)