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1. (WO2017038922) ADHESIVE SHEET

Pub. No.:    WO/2017/038922    International Application No.:    PCT/JP2016/075609
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Sep 02 01:59:59 CEST 2016
IPC: C09J 7/02
C09J 133/08
C09J 183/04
C09J 201/00
H01L 21/56
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: TAKANO Ken
高野 健
KIKUCHI Kazuhiro
菊池 和浩
SUGINO Takashi
杉野 貴志
KARASAWA Yasunori
柄澤 泰紀
FUCHI Emi
淵 恵美
Title: ADHESIVE SHEET
Abstract:
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the adhesive agent layer (12) is from 22 mJ/m2 to 40 mJ/m2 inclusive.