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1. (WO2017038916) ADHESIVE SHEET
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Pub. No.: WO/2017/038916 International Application No.: PCT/JP2016/075603
Publication Date: 09.03.2017 International Filing Date: 01.09.2016
IPC:
C09J 7/02 (2006.01) ,B32B 27/00 (2006.01) ,B32B 27/36 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/56 (2006.01)
[IPC code unknown for C09J 7/02][IPC code unknown for B32B 27][IPC code unknown for B32B 27/36][IPC code unknown for C09J 201][IPC code unknown for H01L 21/56]
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
高野 健 TAKANO Ken; JP
菊池 和浩 KIKUCHI Kazuhiro; JP
杉野 貴志 SUGINO Takashi; JP
Agent:
特許業務法人樹之下知的財産事務所 KINOSHITA & ASSOCIATES; 東京都杉並区荻窪五丁目26番13号 3階 3rd Floor, 26-13, Ogikubo 5-chome, Suginami-ku, Tokyo 1670051, JP
Priority Data:
2015-17239601.09.2015JP
Title (EN) ADHESIVE SHEET
(FR) FEUILLE ADHÉSIVE
(JA) 粘着シート
Abstract:
(EN) Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising: a substrate (11) having a first surface (11a) and a second surface (11b) on the opposite side from the first surface (11a), the substrate including a polyester resin; an adhesive agent layer (12) layered on the first surface (11a) of the substrate (11); and a hard coat layer (13) layered on the second surface (11b) of the substrate (11). The hard coat layer (13) is a cured film formed by curing an organic/inorganic hybrid material.
(FR) L'invention concerne une feuille adhésive (10) qui est utilisée au moment de sceller un élément semi-conducteur sur la feuille adhésive, la feuille adhésive (10) comprenant : un substrat (11) ayant une première surface (11a) et une seconde surface (11b) sur le côté opposé à la première surface (11a), le substrat comprenant une résine de polyester; une couche d'agent adhésif (12) stratifiée sur la première surface (11a) du substrat (11); et une couche de revêtement dur (13) stratifiée sur la seconde surface (11b) du substrat (11). La couche de revêtement dur (13) est un film durci formé par durcissement d'un matériau hybride organique/minéral.
(JA) 粘着シート上の半導体素子を封止する際に使用される粘着シート(10)であって、第一面(11a)及び第一面(11a)とは反対側の第二面(11b)を有し、ポリエステル系樹脂を含む基材(11)と、基材(11)の第一面(11a)に積層された粘着剤層(12)と、基材(11)の第二面(11b)に積層されたハードコート層(13)と、を有し、ハードコート層(13)は、有機無機ハイブリッド材料を硬化させて形成された硬化皮膜である、粘着シート(10)。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)