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1. (WO2017038913) ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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Pub. No.: WO/2017/038913 International Application No.: PCT/JP2016/075600
Publication Date: 09.03.2017 International Filing Date: 01.09.2016
IPC:
H01L 21/56 (2006.01) ,C09J 7/02 (2006.01) ,C09J 201/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
高野 健 TAKANO Ken; JP
菊池 和浩 KIKUCHI Kazuhiro; JP
淵 恵美 FUCHI Emi; JP
Agent:
特許業務法人樹之下知的財産事務所 KINOSHITA & ASSOCIATES; 東京都杉並区荻窪五丁目26番13号 3階 3rd Floor, 26-13, Ogikubo 5-chome, Suginami-ku, Tokyo 1670051, JP
Priority Data:
2015-17239901.09.2015JP
Title (EN) ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) FEUILLE ADHÉSIVE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR
(JA) 粘着シート及び半導体装置の製造方法
Abstract:
(EN) Disclosed is an adhesive sheet (10) used in a semiconductor device production process involving: a step for attaching, to said adhesive sheet (10), a frame member (20) having a plurality of openings (21) formed therein, said adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) formed on the substrate (11); a step for attaching a semiconductor chip to the adhesive agent layer (12) exposed from the opening (21) in the frame member (20); a step for covering the semiconductor chip with a sealing resin; a step for thermally curing the sealing resin; and a step for peeling the adhesive sheet (10) after said thermal curing. In the adhesive sheet (10): the substrate (11) is bendable; and when the sum of the thickness of the substrate (11) and the thickness of the adhesive agent layer (12) is tAS [µm] and the thickness of the frame member (20) is tFR [µm], the relationship tAS [µm] < tFR [µm] is satisfied.
(FR) L'invention concerne une feuille adhésive (10) utilisée dans un procédé de fabrication de dispositif à semi-conducteur comprenant : une étape consistant à fixer, à ladite feuille adhésive (10), un élément de cadre (20) ayant une pluralité d'ouvertures (21) formées en son sein, ladite feuille adhésive (10) comprenant un substrat (11) et une couche d'agent adhésif (12) formée sur le substrat (11); une étape consistant à fixer une puce semi-conductrice à la couche d'agent adhésif (12) exposée depuis l'ouverture (21) dans l'élément de cadre (20); une étape consistant à recouvrir la puce semi-conductrice avec une résine d'étanchéité; une étape consistant à durcir thermiquement la résine d'étanchéité; et une étape consistant à peler la feuille adhésive (10) après ledit durcissement thermique. Dans la feuille adhésive (10) : le substrat (11) est pliable; et lorsque la somme de l'épaisseur du substrat (11) et de l'épaisseur de la couche d'agent adhésif (12) est tAS [µm] et l'épaisseur de l'élément de cadre (20) est tFR [µm], la relation tAS [µm] < tFR [µm] est satisfaite.
(JA) 基材(11)と基材(11)の上に形成された粘着剤層(12)とを有する粘着シート(10)に、複数の開口部(21)が形成された枠部材(20)を貼着させる工程と、枠部材(20)の開口部(21)にて露出する粘着剤層(12)に半導体チップを貼着させる工程と、前記半導体チップを封止樹脂で覆う工程と、前記封止樹脂を熱硬化させる工程と、熱硬化させた後、粘着シート(10)を剥離する工程と、を有する半導体装置製造プロセスにおいて使用される粘着シート(10)であって、基材(11)は、屈曲可能であり、基材(11)の厚みと粘着剤層(12)の厚みとの和をtAS[μm]とし、枠部材(20)の厚みをtFR[μm]とした場合に、tAS[μm]<tFR[μm]の関係を満たす、粘着シート(10)。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)