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1. (WO2017038825) PLATING MATERIAL HAVING EXCELLENT HEAT RESISTANCE AND METHOD FOR MANUFACTURING SAME
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Pub. No.: WO/2017/038825 International Application No.: PCT/JP2016/075347
Publication Date: 09.03.2017 International Filing Date: 30.08.2016
IPC:
C25D 7/00 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/34 (2006.01) ,C25D 5/50 (2006.01) ,H01R 13/03 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内2丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
藤井 恵人 FUJII, Yoshito; JP
奥野 良和 OKUNO, Yoshikazu; JP
川田 紳悟 KAWATA, Shingo; JP
橘 昭頼 TACHIBANA, Akira; JP
中津川 達也 NAKATSUGAWA, Tatsuya; JP
北河 秀一 KITAGAWA, Shuichi; JP
Agent:
飯田 敏三 IIDA, Toshizo; JP
赤羽 修一 AKABA, Shuichi; JP
Priority Data:
2015-17214701.09.2015JP
Title (EN) PLATING MATERIAL HAVING EXCELLENT HEAT RESISTANCE AND METHOD FOR MANUFACTURING SAME
(FR) MATÉRIAU DE PLACAGE AYANT UNE EXCELLENTE RÉSISTANCE À LA CHALEUR ET PROCÉDÉ POUR SA FABRICATION
(JA) 耐熱性に優れためっき材及びその製造方法
Abstract:
(EN) [Problem] To provide a Sn plating material capable of maintaining desired heat resistance and that does not crack during contact point formation even at a high temperature such as 175°C. [Solution] An Sn plating material (10) having a first ground layer (2) composed of Ni or a Ni alloy, an intermediate layer (4) composed of a CuSn compound, and a surface layer (5) composed of Sn or a Sn alloy in the stated order on an electroconductive substrate (1) composed of Cu or a Cu alloy, wherein the Sn plating material (10), when viewed in the cross section composed of the calendering and thickness directions, has a process-modified layer (6) with a length of 0.5 to 10 µm per 20 µm of boundary length of the first ground layer and the electroconductive substrate remaining on the surface of the electroconductive substrate, or has a plurality of process-modified layers (6) with a total length of 0.5 to 10 µm per 20 µm of boundary length.
(FR) Le problème à résoudre selon l'invention est de fournir un matériau de placage en Sn capable de maintenir une résistance à la chaleur souhaitée et qui ne se fissure pas lors de formation du point de contact, même à une température élevée telle que de 175 °C. La solution proposée selon l'invention est un matériau de placage en Sn (10) ayant une première couche de masse (2) composée de Ni ou d'un alliage de Ni, une couche intermédiaire (4) composée d'un composé de CuSn, et une couche de surface (5) composée de Sn ou d'un alliage de Sn, dans l'ordre indiqué, sur un substrat électroconducteur (1) composé de Cu ou d'un alliage de Cu. Le matériau de placage (10), lorsqu'il est observé en coupe transversale composée des directions de calandrage et d'épaisseur, possède une couche modifiée par traitement (6) ayant une longueur de 0,5 à 10 µm pour 20 µm de longueur limite de la première couche de masse et du substrat électroconducteur restant sur la surface du substrat électroconducteur, ou possède une pluralité de couches modifiées par traitement (6) possédant une longueur totale de 0,5 à 10 µm pour 20 µm de longueur limite.
(JA) 【課題】175℃といった高温でも、所望の耐熱性を維持することができ、また接点部形成時に割れが生じないSnめっき材及びその製造方法を提供する。 【解決手段】CuまたはCu合金からなる導電性基材(1)上にNiまたはNi合金からなる第一下地層(2)、CuSn化合物からなる中間層(4)、SnまたはSn合金からなる表面層(5)の順に各層を有するSnめっき材であって、該Snめっき材は圧延方向と板厚方向からなる断面を見たときに、導電性基材の表面に、第一下地層と導電性基材の界面長さ20μm当たりに、0.5~10μmの長さで加工変質層(6)が残存しているか、界面長さ20μm当たりに、複数の加工変質層(6)が合計で0.5~10μmの長さで存在しているSnめっき材(10)、およびその製造方法と用途。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)