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1. (WO2017038811) SUBSTRATE CONVEYANCE ROBOT AND SUBSTRATE PROCESSING SYSTEM
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Pub. No.: WO/2017/038811 International Application No.: PCT/JP2016/075309
Publication Date: 09.03.2017 International Filing Date: 30.08.2016
IPC:
H01L 21/677 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants:
川崎重工業株式会社 KAWASAKI JUKOGYO KABUSHIKI KAISHA [JP/JP]; 兵庫県神戸市中央区東川崎町3丁目1番1号 1-1, Higashikawasaki-cho 3-chome, Chuo-ku, Kobe-shi, Hyogo 6508670, JP
カワサキロボティクス(ユーエスエー)インコーポレイテッド KAWASAKI ROBOTICS (USA), INC. [US/US]; ミシガン州ウィクソム、レイクビュードライブ 28140 28140 Lakeview Drive Wixom Michigan 48393, US
Inventors:
後藤 博彦 GOTO Hirohiko; JP
マーク タン Mark Tang; US
エリック チャン Eric Chan; US
小野 茂樹 ONO Shigeki; US
北野 真也 KITANO Shinya; US
ミン ゼン Ming Zeng; US
Agent:
名塚 聡 NAZUKA Satoshi; JP
井上 満 INOUE Mitsuru; JP
Priority Data:
14/840,59331.08.2015US
Title (EN) SUBSTRATE CONVEYANCE ROBOT AND SUBSTRATE PROCESSING SYSTEM
(FR) ROBOT DE TRANSPORT DE SUBSTRAT ET SYSTÈME DE TRAITEMENT DE SUBSTRAT
(JA) 基板搬送ロボットおよび基板処理システム
Abstract:
(EN) A control means (12) of this substrate conveyance robot (1) causes a robot arm (4) and a substrate holding device (7) to perform a blade member entering motion, a substrate receiving motion, and a substrate mounting motion. The substrate holding device (7) is configured to be switchable between: a first operation state in which a pair of blade members (25, 26) are arranged in the vertical direction; and a second operation state in which the pair of blade members (25, 26) are arranged at positions so as to be misaligned from each other in the vertical direction, and in which a single blade member is allowed to enter a substrate mounting structure. Takt time during substrate conveyance can be shortened irrespective of the type of the substrate mounting structure.
(FR) L'invention concerne un moyen de commande (12) de ce robot de transport (1) de substrat qui amène un bras (4) de robot et un dispositif (7) de maintien de substrat à effectuer mouvement d'entrée d'élément de lame, un mouvement de réception de substrat, et un mouvement de montage de substrat. Le dispositif (7) de maintien de substrat est conçu pour être commutable entre : un premier état de fonctionnement dans lequel deux éléments de lame (25, 26) sont agencés dans la direction verticale ; et un second état de fonctionnement dans lequel les deux éléments de lame (25, 26) sont agencés au niveau de positions données de façon à ne pas être alignés l'un par rapport l'autre dans la direction verticale, et dans lequel un seul élément de lame est autorisé à entrer dans une structure de montage de substrat. Le temps takt pendant le transport du substrat peut être raccourci quel que soit le type de la structure de montage de substrat.
(JA) 基板搬送ロボット(1)の制御手段(12)は、ブレード部材進入動作と、基板受取り動作と、基板載置動作とを、ロボットアーム(4)および基板保持装置(7)に実施させる。基板保持装置(7)は、一対のブレード部材(25,26)が上下方向に配置された第1稼働状態と、一対のブレード部材(25,26)が上下方向から外れた位置に配置され、単一のブレード部材を基板載置構造に進入可能とする第2稼働状態とを切り換え可能に構成されている。基板載置構造の種類にかかわらず、基板搬送時のタクトタイムを短縮できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)