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1. (WO2017038664) COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/038664    International Application No.:    PCT/JP2016/074924
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Aug 27 01:59:59 CEST 2016
IPC: C08L 79/08
C08F 2/44
C08K 5/33
C08L 79/04
G03F 7/004
G03F 7/027
G03F 7/031
G03F 7/037
G03F 7/20
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: KOYAMA Ichiro
小山 一郎
SHIBUYA Akinori
渋谷 明規
IWAI Yu
岩井 悠
Title: COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Abstract:
Provided is a composition containing a crosslinking agent and at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole, and a polybenzoxazole precursor, said composition having an excellent storage stability. Further provided are a cured film using the composition, a method for manufacturing a cured film, a method for manufacturing a semiconductor device, and a semiconductor device. The composition contains: at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole precursor, and a polybenzoxazole; a crosslinking agent; a first solvent that dissolves the resin in a proportion of at least 5 mass% at 25°C, said first solvent being selected from alcohols, esters, ketones, ethers, sulfur-containing compounds, carbonates, and ureas; and a second solvent that has a solubility parameter distance of 3.0-11.0 from the first solvent.