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|1. (WO2017038664) COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE|
|Title:||COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE|
Provided is a composition containing a crosslinking agent and at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole, and a polybenzoxazole precursor, said composition having an excellent storage stability. Further provided are a cured film using the composition, a method for manufacturing a cured film, a method for manufacturing a semiconductor device, and a semiconductor device. The composition contains: at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole precursor, and a polybenzoxazole; a crosslinking agent; a first solvent that dissolves the resin in a proportion of at least 5 mass% at 25°C, said first solvent being selected from alcohols, esters, ketones, ethers, sulfur-containing compounds, carbonates, and ureas; and a second solvent that has a solubility parameter distance of 3.0-11.0 from the first solvent.