Search International and National Patent Collections

1. (WO2017038572) CONDUCTIVE PASTE

Pub. No.:    WO/2017/038572    International Application No.:    PCT/JP2016/074621
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Aug 25 01:59:59 CEST 2016
IPC: H01B 1/22
B22F 1/02
B22F 9/00
C09J 9/02
C09J 11/02
H01B 1/00
H01B 5/14
H05K 3/12
Inventors: NAKAJO, Haruyuki
中城 治之
Provided is a conductive paste which is capable of suppressing the occurrence of a large void in a bonded portion even in cases where a relatively large chip is bonded to a substrate. A conductive paste which contains: a metal powder having an average particle diameter of 0.5-10 μm; fine metal particles; a coating agent covering the surfaces of the fine metal particles; and a solvent in which the metal powder and the fine metal particles are dispersed. The average particle diameter of the fine metal particles, including the coating agent adhering to the surfaces of the fine metal particles, is 1-50 nm. The coating agent is a compound having 6-20 carbon atoms and a carboxyl structure. The solvent is a compound that has at least one structure selected from the group consisting of a hydroxyl structure, an ester structure and an ether structure.