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|1. (WO2017038542) SOLID-STATE IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE|
|Applicants:||SONY SEMICONDUCTOR SOLUTIONS CORPORATION
|Title:||SOLID-STATE IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE|
The present disclosure pertains to a solid-state image pickup element and an electronic device, which are capable of further improving quantum efficiency in a carrier-amplifying type sensor. The solid-state image pickup element according to an aspect of the present disclosure is a carrier-amplifying type solid-state image pickup element that applies an electric field to a depletion layer contained in a photoelectric conversion part to cause photo-multiplication, and is provided with the photoelectric conversion part containing the depletion layer, and a diffraction part which is formed on the surface of the photoelectric conversion part, and which bends the traveling direction of light incident on the photoelectric conversion part. The present disclosure is applicable to, for example, a CMOS image sensor.