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1. (WO2017038460) POWER MODULE, POWER-MODULE HEAT-DISSIPATION STRUCTURE, AND POWER-MODULE JUNCTION METHOD

Pub. No.:    WO/2017/038460    International Application No.:    PCT/JP2016/073951
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Thu Aug 18 01:59:59 CEST 2016
IPC: H01L 23/40
H01L 23/36
Applicants: ROHM CO., LTD.
ローム株式会社
Inventors: YOSHIHARA, Katsuhiko
吉原 克彦
Title: POWER MODULE, POWER-MODULE HEAT-DISSIPATION STRUCTURE, AND POWER-MODULE JUNCTION METHOD
Abstract:
A power module (100) is provided with: a heatsink (106c) having a semiconductor chip, not shown in the figure, bonded thereto; a package (101) for sealing the outer periphery of the semiconductor chip so as to expose at least part of the heatsink (106c); and a thickness-controlling protrusion (104) for controlling the thickness of a heat conducting material (120) when the heatsink (106c) is bonded to a cooler (110) using the heat conducting material (120). The present invention provides a highly reliable power module, power-module heat-dissipation structure, and power-module junction method that can ensure a sufficient cooling performance and suppress deterioration due to overheating.