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1. (WO2017038343) IN-VEHICLE CONTROL DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/038343 International Application No.: PCT/JP2016/072577
Publication Date: 09.03.2017 International Filing Date: 02.08.2016
IPC:
H05K 3/28 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
日立オートモティブシステムズ株式会社 HITACHI AUTOMOTIVE SYSTEMS, LTD. [JP/JP]; 茨城県ひたちなか市高場2520番地 2520, Takaba, Hitachinaka-shi, Ibaraki 3128503, JP
Inventors:
伊藤 真紀 ITO Maki; JP
石井 利昭 ISHII Toshiaki; JP
露野 円丈 TSUYUNO Nobutake; JP
北條 房郎 HOUJOU Fusao; JP
河合 義夫 KAWAI Yoshio; JP
福沢 尭之 FUKUZAWA Takayuki; JP
Agent:
戸田 裕二 TODA Yuji; JP
Priority Data:
2015-17245702.09.2015JP
Title (EN) IN-VEHICLE CONTROL DEVICE
(FR) DISPOSITIF DE COMMANDE EMBARQUÉ
(JA) 車載制御装置
Abstract:
(EN) Provided is an in-vehicle control device that is provided with a protection coating film enabling to improve reliability of a solder bonding section of an electronic component mounted on a circuit board. This in-vehicle control device is provided with: a circuit board; an electronic component mounted on the circuit board; a solder that brings the circuit board and a terminal of the electronic component into electrical contact with each other; and a coating film that protects at least a part of the circuit board. The protection coating film covers the terminal and the solder, and is formed of a material having a loss elastic modulus equal to or higher than 1.0×105 Pa at 125°C.
(FR) L'invention concerne un dispositif de commande embarqué qui est pourvu d'un film de revêtement de protection permettant d'améliorer la fiabilité d'une section de liaison de brasure tendre d'un composant électronique monté sur une carte de circuit imprimé. Ce dispositif de commande embarqué est pourvu : d'une carte de circuit imprimé ; d'un composant électronique monté sur la carte de circuit imprimé ; d'une brasure tendre qui amène la carte de circuit imprimé et une borne du composant électronique en contact électrique l'une avec l'autre ; et d'un film de revêtement qui protège au moins une partie de la carte de circuit imprimé. Le film de revêtement de protection recouvre la borne et la brasure tendre, et est constitué d'un matériau ayant un module d'élasticité de perte supérieur ou égal à 1,0 × 105 Pa à 125 °C.
(JA) 回路基板に実装されている電子部品のはんだ接続部の信頼性向上を可能とする保護コーティング膜を備えた車載制御装置を提供する。回路基板と、前記回路基板に実装される電子部品と、前記電子部品の端子と前記回路基板とを電気的に接触させるはんだと、前記回路基板の少なくとも一部を保護するコーディング膜と、を備えた車載制御装置において、前記保護コーティング膜は、前記端子と前記はんだとを覆い、125℃において損失弾性率が1.0×105Pa以上である材料からなる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)