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|1. (WO2017038333) RESIN COMPOSITION|
A resin composition (10) according to the present invention comprises: a thermoplastic resin (11) having a melting point of 280ºC or higher or a glass transition temperature of 220ºC or higher; and nano diamond particles (12). The content of the nano diamond particles (12) in the resin composition (10) is, for example, 0.001 to 5 parts by weight relative to the whole weight, i.e., 100 parts by weight, of the thermoplastic resin (11). The resin composition (10) is suitable in use applications in which it is desired to achieve high heat resistance of the resin composition (10) while preventing the deterioration and thickening of the resin composition (10) during a processing with heat.