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1. (WO2017038034) MONOCRYSTALLINE WAFER FRONT/REAR DETERMINATION METHOD

Pub. No.:    WO/2017/038034    International Application No.:    PCT/JP2016/003773
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Aug 19 01:59:59 CEST 2016
IPC: G01N 23/207
Applicants: SHIN-ETSU HANDOTAI CO.,LTD.
信越半導体株式会社
Inventors: WATANABE, Shiroyasu
渡邉 城康
Title: MONOCRYSTALLINE WAFER FRONT/REAR DETERMINATION METHOD
Abstract:
The present invention provides a method for determining the front and the rear of a monocrystalline wafer, wherein the monocrystalline wafer front/rear determination method is characterized by: using, as the monocrystalline wafer, a wafer having a crystal plane that is left/right asymmetric with respect to a reference direction connecting the center of the monocrystalline wafer with the center of an orientation-specifying cutout formed on an end surface of the monocrystalline wafer; irradiating the monocrystalline wafer with X-rays and detecting the diffracted X-rays, while particularly observing the left/right asymmetric crystal plane, and thereby measuring the angle formed between the reference direction and the orientation of the crystal plane that is being particularly observed; and on the basis of the value of the measured angle, determining whether a surface of the monocrystalline wafer is the front surface or the rear surface. Due to these features, a monocrystalline wafer front/rear determination method that reliably determines the front and the rear of a monocrystalline wafer and that has excellent cost performance is provided.