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1. (WO2017037996) COMPONENT, SUBSTRATE MODULE, APPARATUS, AND OPTICAL FILTER
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/037996 International Application No.: PCT/JP2016/003430
Publication Date: 09.03.2017 International Filing Date: 22.07.2016
IPC:
H01L 21/52 (2006.01) ,H01L 23/12 (2006.01) ,H01L 33/62 (2010.01) ,H01S 5/022 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1 Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
大鳥居 英 OOTORII, Hiizu; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2015-17506204.09.2015JP
Title (EN) COMPONENT, SUBSTRATE MODULE, APPARATUS, AND OPTICAL FILTER
(FR) COMPOSANT, MODULE DE SUBSTRAT, APPAREIL, ET FILTRE OPTIQUE
(JA) 部品、基板モジュール、機器、および光学フィルタ
Abstract:
(EN) This component is provided with a main body, a first layer, and a second layer. The main body has a bottom surface. The first layer is provided on the bottom surface of the main body, and has a bottom surface. The second layer is bonded to a metal bonding material on a substrate, and is provided by being physically integrated with the metal bonding material. The second layer has wettability with respect to the metal bonding material in a molten state, said wettability being higher than that of the first layer, and is provided protruding from the bottom surface side of the first layer such that at least a part of the bottom surface of the first layer is exposed from the whole outer peripheral side of the second layer.
(FR) L'invention concerne un composant comprenant un corps principal, une première couche et une seconde couche. Le corps principal présente une surface inférieure. La première couche est disposée sur la surface inférieure du corps principal, et présente une surface inférieure. La seconde couche est liée à un matériau de liaison métallique sur un substrat, et est produite par intégration physique avec le matériau de liaison métallique. La seconde couche présente de la mouillabilité relativement au matériau de liaison métallique dans un état fondu, ladite mouillabilité étant supérieure à celle de la première couche, et est disposée faisant saillie côté surface inférieure de la première couche de manière qu'au moins une partie de la surface inférieure de la première couche soit découverte dans la totalité du côté périphérique extérieur de la seconde couche.
(JA) 【解決手段】部品は、本体と、第1の層と、第2の層とを具備する。前記本体は、底面を有する。前記第1の層は、前記本体の底面に設けられ、底面を有する。前記第2の層は、基板上の金属接合材に接合され物理的に一体に設けられた第2の層である。前記第2の層は、溶融状態にある前記金属接合材に対して、前記第1の層の濡れ性より高い濡れ性を持ち、前記第2の層の全外周側で前記第1の層の底面の少なくも一部が露出するように、前記第1の層の底面側から突出して設けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)