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1. (WO2017037951) ADHESIVE COMPOSITION, ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, AND CONNECTED OBJECT

Pub. No.:    WO/2017/037951    International Application No.:    PCT/JP2015/075253
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Sep 05 01:59:59 CEST 2015
IPC: C09J 201/00
C09J 9/02
C09J 11/02
C09J 163/00
H01B 1/20
H01R 11/01
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: KUDOU Sunao
工藤 直
FUJINAWA Tohru
藤縄 貢
MORI Satoru
杜 暁黎
ITO Akihiro
伊藤 彰浩
MORIJIRI Tomoki
森尻 智樹
Title: ADHESIVE COMPOSITION, ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, AND CONNECTED OBJECT
Abstract:
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy group and which contains substantially no cationic polymerization hardener for the epoxy resin.