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|1. (WO2017037828) ENDOSCOPE, ELECTRONIC UNIT, AND ELECTRONIC UNIT MANUFACTURING METHOD|
|Title:||ENDOSCOPE, ELECTRONIC UNIT, AND ELECTRONIC UNIT MANUFACTURING METHOD|
An endoscope 9 is provided with: a chip component 30, which has an image pickup unit 1 at a leading end portion 81 of an inserting section 80, said image pickup unit 1 being provided with a first electrode pad 32 and a second electrode pad 34; an image pickup element 20 that is provided with a third electrode pad 22; and a wiring board 40 having a flying lead 41. The flying lead 41 is inserted into a gap between the chip component 30 and the image pickup element 20, the first electrode pad 32 and the flying lead 41 are bonded to each other by having a first bump 33 therebetween, a bonding section is sealed by a first sealing resin 39, and the second electrode pad 34 and the third electrode pad 22 are bonded to each other by having therebetween a second bump 35 that is higher than the first bump 33, and are sealed by a second sealing resin 29 having a Young's modulus that is smaller than that of the first sealing resin 39.