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1. (WO2017037040) AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER OR COPPER ALLOY ONTO A SUBSTRATE

Pub. No.:    WO/2017/037040    International Application No.:    PCT/EP2016/070365
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Wed Aug 31 01:59:59 CEST 2016
IPC: C25D 7/12
C25D 3/38
Applicants: ATOTECH DEUTSCHLAND GMBH
Inventors: BRUNNER, Heiko
KOHLMANN, Lars
WITCZAK, Agnieszka
MANN, Olivier
Title: AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER OR COPPER ALLOY ONTO A SUBSTRATE
Abstract:
The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.