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1. (WO2017036946) METHOD OF MAKING AN LED DEVICE
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Pub. No.: WO/2017/036946 International Application No.: PCT/EP2016/070168
Publication Date: 09.03.2017 International Filing Date: 26.08.2016
IPC:
H05K 1/02 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
LUMILEDS HOLDING B.V. [NL/NL]; Schiphol Boulevard 127 1118 BG Schiphol, NL
Inventors:
DERIX, Robert; DE
Agent:
TER HEEGDE, Paul; DE
Priority Data:
15183612.903.09.2015EP
Title (EN) METHOD OF MAKING AN LED DEVICE
(FR) PROCÉDÉ DE FABRICATION DE DISPOSITIFÀ DEL
Abstract:
(EN) A method of manufacturing an LED device, comprising: providing a circuit board substrate, the circuit board substrate comprising a stack of core layers (26, 27), a pre-preg layer (28) and copper layers (25, 29), the circuit board substrate further comprising a receiving portion for receiving an LED module (14); providing the LED module in the receiving portion, wherein the LED module comprises an LED chip mounted on an LED substrate; and after providing the LED module in the receiving portion, applying heat and pressure to bond the core layers of the circuit board substrate together and to integrate the LED substrate with the circuit board substrate.
(FR) L'invention concerne un procédé de fabrication d'un dispositif à DEL, comprenant : la fourniture d'un substrat de carte de circuit imprimé, le substrat de carte de circuit imprimé comprenant un empilement de couches centrales (26, 27), une couche pré-imprégnée (28) et des couches de cuivre (25, 29), le substrat de carte de circuit imprimé comprenant en outre une partie de réception destinée à recevoir un module à DEL (14); la fourniture du module à DEL dans la partie de réception, dans laquelle le module à DEL comprend une puce à DEL montée sur un substrat de DEL; et après la fourniture du module à DEL dans la partie de réception, l'application de chaleur et de pression pour lier les couches centrales du substrat de carte de circuit imprimé l'une à l'autre et pour intégrer le substrat de DEL avec le substrat de carte de circuit imprimé.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)