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1. (WO2017036827) IC DIE, PROBE AND ULTRASOUND SYSTEM

Pub. No.:    WO/2017/036827    International Application No.:    PCT/EP2016/069752
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Aug 20 01:59:59 CEST 2016
IPC: B06B 1/02
A61B 8/12
B81C 1/00
Applicants: KONINKLIJKE PHILIPS N.V.
Inventors: SUDOL, Wojtek
Title: IC DIE, PROBE AND ULTRASOUND SYSTEM
Abstract:
An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.