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1. (WO2017036512) METHOD OF PROCESSING WAFER AND PROTECTIVE SHEETING FOR USE IN THIS METHOD

Pub. No.:    WO/2017/036512    International Application No.:    PCT/EP2015/069854
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Tue Sep 01 01:59:59 CEST 2015
IPC: H01L 21/78
H01L 21/68
H01L 21/683
Applicants: PRIEWASSER, Karl Heinz
Inventors: PRIEWASSER, Karl Heinz
Title: METHOD OF PROCESSING WAFER AND PROTECTIVE SHEETING FOR USE IN THIS METHOD
Abstract:
The invention relates to a method of processing a wafer (w), having on one side (1) a device area (2) with a plurality of devices, partitioned by a plurality of division lines (11), and a peripheral marginal area (3) having no devices and being formed around the device area (2), wherein the device area (2) is formed with a plurality of protrusions (14) protruding from a plane surface of the wafer (W). The method comprises providing a protective film (4), providing a base sheet (7) having a cushioning layer (13) applied to a front surface (17) thereof, attaching a front surface of the protective film (4), for covering the devices on the wafer (W), to the one side (1) of the wafer (W), wherein the protective film (4) is adhered to at least the peripheral marginal area (3) with an adhesive (9), and attaching a back surface of the protective film (4) opposite to the front surface thereof to the cushioning layer (13). The protrusions (14) protruding from the plane surface of the wafer (W) are embedded in the cushioning layer (13) and a back surface (18) of the base sheet (7) opposite to the front surface (17) thereof is substantially parallel to the side (6) of the wafer (W) being opposite to the one side (1). The method further comprises grinding the side (6) of the wafer (W) being opposite to the one side (1) for adjusting the wafer thickness. The invention further relates to a protective sheeting (5, 5') for use in such a processing method.