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1. (WO2017036381) PACKAGE STRUCTURE AND PACKAGING METHOD

Pub. No.:    WO/2017/036381    International Application No.:    PCT/CN2016/097359
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Wed Aug 31 01:59:59 CEST 2016
IPC: H01L 27/146
Applicants: CHINA WAFER LEVEL CSP CO., LTD.
苏州晶方半导体科技股份有限公司
Inventors: WANG, Zhiqi
王之奇
HONG, Fangyuan
洪方圆
Title: PACKAGE STRUCTURE AND PACKAGING METHOD
Abstract:
A package structure and packaging method. The package structure comprises: a chip unit (210), a first surface (210a) of the chip unit comprising a sensing region (211); an upper cover plate (330), a first surface (330a) of the upper cover plate having a support structure (320), the upper cover plate covering the first surface of the chip unit, the support structure being located between the upper cover plate and the chip unit, and the sensing region being located in a cavity enclosed by the support structure and the first surface of the chip unit; and a light shielding layer, the light shielding layer covering on a second surface (330b) of the upper cover plate opposite to the first surface and exposing a middle region of the second surface coinciding with the sensing region in a light transmissive direction. The package structure and packaging method of the present invention can reduce interference lights incident on the sensing region.