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1. (WO2017036344) IMAGE SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

Pub. No.:    WO/2017/036344    International Application No.:    PCT/CN2016/096737
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Aug 26 01:59:59 CEST 2016
IPC: H01L 27/146
Applicants: CHINA WAFER LEVEL CSP CO., LTD.
苏州晶方半导体科技股份有限公司
Inventors: WANG, Zhiqi
王之奇
SHEN, Zhijie
沈志杰
CHEN, Jiawei
陈佳炜
Title: IMAGE SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
Abstract:
Provided are an image sensor package structure and packaging method thereof, the package structure comprising: a chip to be packaged (21) comprising a first surface (21a) and a second surface (21b) respectively provided on two sides of the chip (21), wherein the first surface (21a) is provided with a photosensitive area (211) thereon and a first bonding pad (212) located around the photosensitive area (211); and a substrate (22) arranged at a side of the first surface (21a) of the chip (21), wherein the substrate (22) comprises a third surface (22a) and a fourth surface (22b) respectively provided on two sides of the substrate (22), and the third surface (22a) is provided with a second bonding pad (221) and a third bonding pad (222) thereon. The second bonding pad (221) is located at a side of the third bonding pad (222) opposite to the photosensitive area (211). The first surface (21a) of the chip (21) is opposite to the third surface (22a) of the substrate. The first bonding pad (212) and the third bonding pad (222) are connected together. The image sensor package structure provides a chip to be packaged with improved protection, and can avoid chip cracking.