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1. (WO2017036096) FLEXIBLE SUBSTRATE FOR PACKAGING, AND PACKAGING BODY

Pub. No.:    WO/2017/036096    International Application No.:    PCT/CN2016/073838
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Wed Feb 17 00:59:59 CET 2016
IPC: H01L 27/12
H05K 1/03
Applicants: BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
Inventors: ZHANG, Bo
张博
LI, Wenbo
李文波
Title: FLEXIBLE SUBSTRATE FOR PACKAGING, AND PACKAGING BODY
Abstract:
A flexible substrate for packaging, and a packaging body. The flexible substrate (5) for packaging comprises: a bendable region (3), provided in the middle of the flexible substrate (5); chips (1), provided at two sides of the bendable region (3) and at two ends of the flexible substrate (5); and a lead (2), connected between the chips (1) and passing through the bendable region (3). A part, corresponding to the bendable region (3), of the lead (2) is provided with an anti-stress structure (4), the anti-stress structure (4) being used for releasing anti-stretching and anti-compression stresses when the bendable region (3) is bent.