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1. (WO2017036055) THERMALLY CONDUCTIVE STRUCTURE AND HEAT DISSIPATION DEVICE

Pub. No.:    WO/2017/036055    International Application No.:    PCT/CN2016/000467
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Fri Aug 19 01:59:59 CEST 2016
IPC: H05K 7/20
Applicants: CNANO (ZHENJIANG) TECHNOLOGY LTD.
天奈(镇江)材料科技有限公司
Inventors: CAI, Weizheng
蔡韦政
YANG, Zhiwei
杨智伟
ZHENG, Tao
郑涛
MAO, Ou
毛鸥
ZHANG, Meijie
张美杰
Title: THERMALLY CONDUCTIVE STRUCTURE AND HEAT DISSIPATION DEVICE
Abstract:
A thermally conductive structure (1) and heat dissipation device (2). The thermally conductive structure (1) comprises a first thermally conductive layer (11) and a second thermally conductive layer (12). The first thermally conductive layer (11) comprises a graphene material (111) and first carbon nanotubes (112), and the first carbon nanotubes (112) are dispersed in the graphene material (111). The second thermally conductive layer (12) is stacked on the first thermally conductive layer (11), and comprises a porous material (121) and second carbon nanotubes (122). The second carbon nanotubes (122) are dispersed in the porous material (121). The heat dissipation device (2) comprises the thermally conductive structure (1) and a heat dissipation structure (4). The thermally conductive structure (1) is in contact with a heat source, and the heat dissipation structure (4) is connected to the thermally conductive structure (1). The thermally conductive structure (1) and heat dissipation device (2) have a feature of being slim, and meet the slim and lightweight requirement of modern electronic products.