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1. (WO2017035974) CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF

Pub. No.:    WO/2017/035974    International Application No.:    PCT/CN2015/096520
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Tue Dec 08 00:59:59 CET 2015
IPC: D06M 15/00
D06M 15/53
D06M 15/227
Applicants: SHENGYI TECHNOLOGY CO.,LTD.
广东生益科技股份有限公司
Inventors: YAN, Shanyin
颜善银
XU, Yongjing
许永静
YANG, Zhongqiang
杨中强
ZHU, Yongming
朱泳名
Title: CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF
Abstract:
The present invention provides a preparation method of a pretreated low-Dk glass fiber fabric for forming a circuit substrate, the method comprising: pretreating a low-Dk glass fiber fabric by using a pretreatment glue solution having a Dk approximating to a Dk of said low-Dk glass fiber fabric across different temperatures and having a low Df. The present invention further provides a bonding sheet and a circuit substrate prepared by the method. The present invention enables the circuit substrate prepared by the circuit substrate preparation method to have a small Dk difference between a warpwise direction and a weftwise direction, thereby effectively addressing an issue of signal time delay, and to have a low Df to reduce a signal loss of the circuit substrate. Moreover, a resulting cured, partially-cured or uncured dried glue from baking the pretreatment glue solution to remove a solvent, and the low-Dk glass fiber fabric have similar dielectric properties across different temperatures, so that the circuit substrate has a considerably small signal time delay across different temperatures.