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|1. (WO2017035974) CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF|
|Applicants:||SHENGYI TECHNOLOGY CO.,LTD.
|Title:||CIRCUIT SUBSTRATE AND PREPARATION METHOD THEREOF|
The present invention provides a preparation method of a pretreated low-Dk glass fiber fabric for forming a circuit substrate, the method comprising: pretreating a low-Dk glass fiber fabric by using a pretreatment glue solution having a Dk approximating to a Dk of said low-Dk glass fiber fabric across different temperatures and having a low Df. The present invention further provides a bonding sheet and a circuit substrate prepared by the method. The present invention enables the circuit substrate prepared by the circuit substrate preparation method to have a small Dk difference between a warpwise direction and a weftwise direction, thereby effectively addressing an issue of signal time delay, and to have a low Df to reduce a signal loss of the circuit substrate. Moreover, a resulting cured, partially-cured or uncured dried glue from baking the pretreatment glue solution to remove a solvent, and the low-Dk glass fiber fabric have similar dielectric properties across different temperatures, so that the circuit substrate has a considerably small signal time delay across different temperatures.