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1. (WO2017035866) THIN FILM PACKAGING METHOD AND ORGANIC LIGHT-EMITTING DEVICE

Pub. No.:    WO/2017/035866    International Application No.:    PCT/CN2015/089428
Publication Date: Fri Mar 10 00:59:59 CET 2017 International Filing Date: Sat Sep 12 01:59:59 CEST 2015
IPC: H01L 51/56
H01L 51/52
Applicants: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
深圳市华星光电技术有限公司
Inventors: ZENG, Weijing
曾维静
ZHOU, Xingyu
周星宇
Title: THIN FILM PACKAGING METHOD AND ORGANIC LIGHT-EMITTING DEVICE
Abstract:
A thin film packaging method and an organic light-emitting device. The packaging method comprises the following steps: forming an OLED layer on a TFT substrate; forming a first inorganic package layer on the OLED layer; forming a couplant unit on the first inorganic package layer; and forming an organic package layer on the couplant unit, wherein the organic package layer comprises a buffer sub-layer and a barrier sub-layer formed in sequence. The couplant unit undergoes chemical reaction with the first inorganic package layer and the buffer sub-layer separately to improve the bonding strength between the first inorganic package layer and the organic package layer, so that the two layers are peeling-resistant and have good water and oxygen barrier properties.