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1. (WO2017035321) CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Pub. No.:    WO/2017/035321    International Application No.:    PCT/US2016/048609
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Fri Aug 26 01:59:59 CEST 2016
IPC: H01L 21/18
H01L 21/52
H01L 23/00
Applicants: INVENSAS BONDING TECHNOLOGIES, INC.
Inventors: ENQUIST, Paul, M.
Title: CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Abstract:
A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non- metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.