Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017035301) COMMUNICATION NODE WITH DIGITAL PLANE INTERFACE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/035301 International Application No.: PCT/US2016/048549
Publication Date: 02.03.2017 International Filing Date: 25.08.2016
IPC:
H04L 25/02 (2006.01) ,H04L 29/10 (2006.01) ,H04L 12/10 (2006.01) ,H04L 12/66 (2006.01) ,G06F 1/26 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
L
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
25
Baseband systems
02
Details
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
L
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
29
Arrangements, apparatus, circuits or systems, not covered by a single one of groups H04L1/-H04L27/136
02
Communication control; Communication processing
10
characterised by an interface, e.g. the interface between the data link level and the physical level
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
L
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
12
Data switching networks
02
Details
10
Current supply arrangements
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
L
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
12
Data switching networks
66
Arrangements for connecting between networks having differing types of switching systems, e.g. gateways
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
26
Power supply means, e.g. regulation thereof
Applicants:
MOLEX, LLC [US/US]; 2222 Wellington Court Lisle, Illinois 60532, US
Inventors:
PANELLA, Augusto; US
CHEN, Johnny; US
LANG, Harold Keith; US
Agent:
SHELDON, Stephen L.; US
Priority Data:
62/209,44825.08.2015US
Title (EN) COMMUNICATION NODE WITH DIGITAL PLANE INTERFACE
(FR) NOEUD DE COMMUNICATION À INTERFACE DE PLAN NUMÉRIQUE
Abstract:
(EN) A solution is provided that can be used in a communication node. A case is provided that supports a first circuit board that is connected to a second circuit board via a connection. The first circuit board supports an integrated circuit module and the second circuit board supports a PHY module. A transformer box is mounted on the first circuit board and supports terminals for engagement with a mating connector. A third circuit board can be provided that is parallel to the second circuit board and is mounted on the transformer box so that termination of signals provided to the terminals can take place on a different circuit board than the second circuit board. The third circuit board can also provide power over Ethernet (POE) circuitry.
(FR) L'invention concerne une solution utilisable dans un noeud de communication. Un boîtier est mis en oeuvre, qui porte une première carte de circuit imprimé raccordée à une deuxième carte de circuit imprimé par l'intermédiaire d'un raccordement. La première carte de circuit imprimé porte un module de circuit intégré et la seconde carte de circuit imprimé porte un module PHY. Un boîtier à transformateurs est monté sur la première carte de circuit imprimé et porte des bornes venant en prise avec un connecteur homologue. Une troisième carte de circuit imprimé peut être mis en oeuvre, en parallèle à la deuxième carte de circuit imprimé, et s'installer sur le boîtier à transformateurs de sorte que la fin de signaux fournis aux terminaux puisse intervenir sur une carte de circuit imprimé autre que la deuxième carte de circuit imprimé. La troisième carte de circuit imprimé peut également fournir des circuits d'alimentation sur Ethernet [power over Ethernet (POE)].
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)