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1. (WO2017035106) LASER SEALED HOUSING FOR ELECTRONIC DEVICE
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Pub. No.: WO/2017/035106 International Application No.: PCT/US2016/048103
Publication Date: 02.03.2017 International Filing Date: 23.08.2016
IPC:
H01L 51/52 (2006.01) ,B23K 26/20 (2014.01) ,H01L 51/56 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
20
Bonding, e.g. welding
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants:
CORNING INCORPORATED [US/US]; 1 Riverfront Plaza Corning, New York 14831, US
Inventors:
LOGUNOV, Stephan Lvovich; US
QUESADA, Mark Alejandro; US
STRELTSOV, Alexander Mikhailovich; US
Agent:
MAGAZINER, Russell Scott; US
Priority Data:
62/208,90024.08.2015US
Title (EN) LASER SEALED HOUSING FOR ELECTRONIC DEVICE
(FR) BOÎTIER SCELLÉ AU LASER POUR DISPOSITIF ÉLECTRONIQUE
Abstract:
(EN) A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.
(FR) Cette invention concerne un boîtier de dispositif électronique scellé, soudé au laser, ainsi que des systèmes et procédés associés. Le boîtier scellé comprend un premier substrat possédant une première surface et un second substrat possédant une seconde surface faisant face à la première surface. Le boîtier scellé comprend en outre un évidement formé dans le premier substrat. L'évidement fait face à la seconde surface de sorte que la seconde surface et l'évidement définissent une chambre. Une soudure laser relie la première surface à la seconde surface, et la soudure laser entoure la chambre. Un film fonctionnel est supporté par au moins l'une de la première surface et de la seconde surface, et le film fonctionnel s'étend à partir de la chambre et à travers la soudure laser. Dans des configurations données à titre d'exemple, le dispositif est un dispositif à DELO et le film fonctionnel forme des fils conducteurs en communication avec le dispositif à DELO.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)