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1. (WO2017034958) GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES

Pub. No.:    WO/2017/034958    International Application No.:    PCT/US2016/047728
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Sat Aug 20 01:59:59 CEST 2016
IPC: H05K 1/02
H05K 1/03
H01L 23/15
C03C 17/00
H05K 3/10
H05K 3/46
Applicants: CORNING INCORPORATED
Inventors: GARNER, Sean Matthew
LIN, Jen-Chieh
SORENSEN, Michael Lesley
Title: GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES
Abstract:
Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μιη. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.