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1. (WO2017034940) COVERSLIP REMOVAL SYSTEMS AND METHODS
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Pub. No.: WO/2017/034940 International Application No.: PCT/US2016/047684
Publication Date: 02.03.2017 International Filing Date: 19.08.2016
IPC:
G01N 1/36 (2006.01) ,G02B 21/34 (2006.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
1
Sampling; Preparing specimens for investigation
28
Preparing specimens for investigation
36
Embedding or analogous mounting of samples
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
21
Microscopes
34
Microscope slides, e.g. mounting specimens on microscope slides
Applicants:
SKONE, Rene, Benson [US/US]; US
Inventors:
SKONE, Rene, Benson; US
Agent:
LUCCI, Joseph; US
Priority Data:
62/208,22921.08.2015US
Title (EN) COVERSLIP REMOVAL SYSTEMS AND METHODS
(FR) SYSTÈMES ET PROCÉDÉS DE RETRAIT DE LAMELLE COUVRE-OBJET
Abstract:
(EN) Systems for removing coverslips preferably include a substantially planar base and at least one slide assembly that is disposed upon said substantially planar base. The substantially planar base comprises a sample of mammalian tissue that is disposed upon a substantially rigid support layer and a coverslip that is bound to the sample. The systems of the invention preferably also include a heat source that is in thermal communication with the slide assembly.
(FR) L'invention concerne des systèmes permettant de retirer des lamelles couvre-objet qui comprennent, de préférence, une base sensiblement plane et au moins un ensemble lame qui est disposé sur ladite base sensiblement plane. La base sensiblement plane comprend un échantillon de tissu de mammifère qui est placé sur une couche support sensiblement rigide et une lamelle couvre-objet qui est lié à l'échantillon. Les systèmes de l'invention comprennent également, de préférence, une source de chaleur qui est en communication thermique avec l'ensemble lame.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)