Search International and National Patent Collections

1. (WO2017034589) MULTI-DIE PACKAGE

Pub. No.:    WO/2017/034589    International Application No.:    PCT/US2015/047291
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Fri Aug 28 01:59:59 CEST 2015
IPC: H01L 23/48
Applicants: INTEL CORPORATION
Inventors: SANKMAN, Robert L.
OVROM III, Allan A.
STARKSTON, Robert
ARAD, Oren
Title: MULTI-DIE PACKAGE
Abstract:
Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed