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1. (WO2017034533) SUBSTRATE BACKSIDE TEXTURING

Pub. No.:    WO/2017/034533    International Application No.:    PCT/US2015/046438
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Sun Aug 23 01:59:59 CEST 2015
IPC: H01L 21/027
Applicants: TOKYO ELECTRON LIMITED
TOKYO ELECTRON U.S. HOLDINGS, INC.
Inventors: FONSECA, Carlos A.
RATHSACK, Benjamen
SMITH, Jeffrey
DEVILLIERS, Anton J.
HULI, Lior
KODAMA, Teruhiko
HOOGE, Joshua, S.
Title: SUBSTRATE BACKSIDE TEXTURING
Abstract:
Embodiments described relate to a method and apparatus for reducing lithographic distortion. A backside of a semiconductor substrate may be texturized. Then a lithographic process may be performed on the semiconductor substrate having the texturized backside.