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1. (WO2017034515) CIRCUIT PACKAGE

Pub. No.:    WO/2017/034515    International Application No.:    PCT/US2015/046265
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Sat Aug 22 01:59:59 CEST 2015
IPC: H01L 23/28
H01L 23/48
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventors: CHEN, Chien-Hua
CUMBIE, Michael W.
FARRAR, Stephen
Title: CIRCUIT PACKAGE
Abstract:
A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.