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1. (WO2017034257) WEARABLE FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR AND WEARABLE SMART DEVICE USING SAME
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Pub. No.: WO/2017/034257 International Application No.: PCT/KR2016/009233
Publication Date: 02.03.2017 International Filing Date: 22.08.2016
IPC:
H05K 1/03 (2006.01) ,B32B 5/06 (2006.01) ,H05K 3/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5
Layered products characterised by the non-homogeneity or physical structure of a layer
02
characterised by structural features of a layer comprising fibres or filaments
06
characterised by a fibrous layer needled to another layer, e.g. of fibres, of paper
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
Applicants:
주식회사 아모그린텍 AMOGREENTECH CO., LTD. [KR/KR]; 경기도 김포시 통진읍 김포대로1950번길 91 91, Gimpo-daero 1950beon-gil, Tongjin-eup Gimpo-si Gyeonggi-do 10014, KR
Inventors:
서인용 SEO, In Yong; KR
Agent:
이재화 LEE, Jae Hwa; KR
Priority Data:
10-2015-011790121.08.2015KR
Title (EN) WEARABLE FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR AND WEARABLE SMART DEVICE USING SAME
(FR) CARTE DE CIRCUIT IMPRIMÉ SOUPLE VESTIMENTAIRE, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF INTELLIGENT VESTIMENTAIRE L'UTILISANT
(KO) 웨어러블 플렉서블 인쇄회로기판 및 그의 제조 방법과 이를 이용한 웨어러블 스마트 장치
Abstract:
(EN) The present invention relates to a wearable flexible printed circuit board, a manufacturing method therefor and a wearable smart device using same, the wearable flexible printed circuit board having a conductive circuit pattern formed on a fiber web that is formed by the accumulation of fiber, thereby enabling a base substrate to have flexibility, restorability, waterproofness and air permeability, and thus the wearable flexible printed circuit board being capable of being applied to a future-oriented device. The wearable flexible printed circuit board comprises: a base substrate which is formed of a fiber-forming polymeric material and is formed of a fiber web formed by being integrated by means of spun fiber having a diameter of 3µm or less; and a conductive circuit pattern which is formed on the base substrate.
(FR) La présente invention concerne une carte de circuit imprimé souple vestimentaire, son procédé de fabrication et un dispositif intelligent vestimentaire l'utilisant, la carte de circuit imprimé souple vestimentaire ayant un tracé de circuit conducteur formé sur un réseau de fibres qui est formé par l'accumulation de fibres, ce qui permet à un substrat de base de présenter une flexibilité, une récupération, une étanchéité à l'eau et une perméabilité à l'air, et, par conséquent, la carte de circuit imprimé souple vestimentaire étant capable d'être appliquée à un dispositif prospectif. La carte de circuit imprimé souple vestimentaire comprend : un substrat de base qui est constitué d'un matériau polymère formant des fibres et d'un réseau de fibres formé par intégration au moyen d'une fibre filée présentant un diamètre inférieur ou égal à 3 µm; et un tracé de circuit conducteur qui est formé sur le substrat de base.
(KO) 본 발명은 섬유가 축적되어 형성된 섬유 웹에 전도성 회로 패턴을 형성함에 의해, 베이스 기재가 가요성, 복원성, 방수성 및 통기성을 갖고 있어 미래지향적인 디바이스에 적용할 수 있는 웨어러블 플렉서블 인쇄회로기판 및 그의 제조 방법과 이를 이용한 웨어러블 스마트 장치에 관한 것이다. 상기 웨어러블 플렉서블 인쇄회로기판은 섬유 성형성 고분자 물질로 이루어지며, 방사된 직경 3㎛ 이하의 섬유에 의해 집적되어 형성된 섬유 웹으로 이루어진 베이스 기재; 및 상기 베이스 기재에 형성된 전도성 회로 패턴;을 포함하는 것을 특징으로 한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)