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1. (WO2017034172) LASER SOLDERING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/034172 International Application No.: PCT/KR2016/008536
Publication Date: 02.03.2017 International Filing Date: 03.08.2016
IPC:
H05K 3/34 (2006.01) ,B23K 1/005 (2006.01) ,B23K 26/06 (2014.01) ,B23K 26/064 (2014.01) ,B23K 26/067 (2006.01) ,B23K 26/211 (2014.01) ,B23K 31/12 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
[IPC code unknown for B23K 1/05]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
[IPC code unknown for B23K 26/064]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
067
Dividing the beam into multiple beams, e.g. multi-focusing
[IPC code unknown for B23K 26/211]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31
Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/-B23K28/193
12
relating to investigating the properties, e.g. the weldability, of materials
Applicants:
(주)이오테크닉스 EO TECHNICS CO.,LTD. [KR/KR]; 경기도 안양시 동안구 동편로 91 91, Dongpyeon-ro Dongan-gu, Anyang-si, Gyeonggi-do 13930, KR
Inventors:
전주현 JEON, Ju Hyun; KR
박거동 PARK, Ko Dong; KR
김고은 KIM, Go Eun; KR
정태오 CHUNG, Tai O; KR
Agent:
리앤목 특허법인 Y.P.LEE, MOCK & PARTNERS; 서울시 강남구 언주로 30길 13 대림아크로텔 12층 12F Daelim Acrotel, 13 Eonju-ro 30-gil Gangnam-gu, Seoul 06292, KR
Priority Data:
10-2015-011983025.08.2015KR
Title (EN) LASER SOLDERING DEVICE
(FR) DISPOSITIF DE BRASAGE LASER
(KO) 레이저 솔더링 장치
Abstract:
(EN) Disclosed is a laser soldering device for performing a soldering process by emitting a laser beam at a soldering process area on a substrate. The disclosed laser soldering device comprises: a laser light source for oscillating a multi-mode laser beam; and an optical system processing the multi-mode laser beam emitted from the laser light source and emitting the laser beam at the soldering process area, and including a collimator forming the incident multi-mode laser beam as a parallel beam of a certain size and emitting the parallel beam.
(FR) L'invention concerne un dispositif de brasage laser permettant d'effectuer un traitement de brasage par l'émission d'un faisceau laser au niveau d'une zone de traitement de brasage sur un substrat. Le dispositif de brasage laser selon la présente invention comprend : une source de lumière laser permettant de faire osciller un faisceau laser multimode ; et un système optique traitant le faisceau laser multimode émis par la source de lumière laser et émettant le faisceau laser au niveau de la zone de traitement de brasage, et comprenant un collimateur formant le faisceau laser multimode incident sous la forme d'un faisceau parallèle d'une certaine taille et émettant le faisceau parallèle.
(KO) 기판 상의 솔더링 가공 영역에 레이저 빔을 조사하여 솔더링 공정을 수행하는 레이저 솔더링 장치가 개시된다. 개시된 레이저 솔더링 장치는, 다중모드 레이저 빔을 발진시키는 레이저 광원; 및 상기 레이저 광원으로부터 방출된 상기 다중모드 레이저 빔을 처리하여 상기 솔더링 가공 영역에 조사하는 것으로, 입사되는 상기 다중모드 레이저 빔을 일정한 크기의 평행빔으로 만들어 출사시키는 콜리메이터(collimator)를 포함하는 광학계;를 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)