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1. (WO2017034003) THERMALLY CONDUCTIVE RESIN COMPOSITION

Pub. No.:    WO/2017/034003    International Application No.:    PCT/JP2016/074859
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Fri Aug 26 01:59:59 CEST 2016
IPC: C08L 101/00
C08K 3/38
C08K 7/18
Applicants: DENKA COMPANY LIMITED
デンカ株式会社
Inventors: TAKEDA,Go
竹田 豪
Title: THERMALLY CONDUCTIVE RESIN COMPOSITION
Abstract:
A heat dissipation member having excellent thermal conductivity and dielectric breakdown characteristics is able to be achieved by using a thermally conductive resin composition according to the present invention. A thermally conductive resin composition which is characterized in that: the blending ratio of a spherical boron nitride fine powder having an average particle diameter of 0.05-1.0 μm, an average circularity of 0.80 or more and a purity of boron nitride of 96% by mass or more to a boron nitride coarse powder having an average particle diameter of 20-85 μm and a graphitization index of 1.5-4.0 is from 5:95 to 40:60 in terms of volume ratio; and the total content of the spherical boron nitride fine powder and the boron nitride coarse powder in the resin composition is 40-85% by volume. A heat dissipation sheet which uses this thermally conductive resin composition. A heat dissipation member for electronic components, which uses this thermally conductive resin composition.