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|1. (WO2017033956) DIMER-CONTAINING POLYAMIDE RESIN AND RESIN COMPOSITION OF SAME|
|Title:||DIMER-CONTAINING POLYAMIDE RESIN AND RESIN COMPOSITION OF SAME|
The purpose of the present invention is to provide: a resin composition which exhibits good adhesion to a copper surface, a polyimide surface and a gold-plated surface, while having excellent adhesiveness after heat resistance test and after wet heat resistance test; and a polyamide resin which is useful for this resin composition. The description of the present invention discloses a resin composition which contains (A) a polyamide resin that contains, in the main chain skeleton, a divalent linking group formed by removing two carboxyl groups from a dimer acid that is a dimer of an unsaturated aliphatic monocarboxylic acid having 8-22 carbon atoms and/or a divalent linking group formed by removing two amino groups from a dimer amine that is a dimer of an unsaturated aliphatic monoamine having 8-22 carbon atoms, and an ether bond, and (B) an epoxy resin, and wherein: the content of the epoxy resin (B) relative to the total of the polyamide resin (A) and the epoxy resin (B) is from 1% by mass to 50% by mass; and the epoxy resin (B) contains one or more epoxy resins selected from the group consisting of epoxy resins represented by formulae (1-1) and (1-2).