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1. (WO2017033950) ELECTRONIC CIRCUIT SUBSTRATE

Pub. No.:    WO/2017/033950    International Application No.:    PCT/JP2016/074586
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Thu Aug 25 01:59:59 CEST 2016
IPC: H05K 1/18
H01G 2/06
H05K 1/02
Applicants: TDK CORPORATION
TDK株式会社
Inventors: FUKUNAGA Tatsuya
福永 達也
Title: ELECTRONIC CIRCUIT SUBSTRATE
Abstract:
Provided is an electronic circuit substrate capable of reducing equivalent series inductance, which is the parasitic inductance of a capacitor or the inductance of the wiring of a mounting substrate. An electronic circuit substrate 1 having a capacitor 104 and a mounting substrate 111 that has a DC power source layer and a ground layer, the electronic circuit substrate 1 being characterized in that the capacitor 104 is mounted onto the mounting substrate 111 by being connected to the DC power source layer and the ground layer via wiring 103a, 103b, in that a first inductor, which is the parasitic inductor component of the capacitor 104, and a second inductor, which is the inductor component for the wiring 103a, 103b, are connected in series, and by also having a closed conductor loop for magnetically coupling with the first inductor and/or the second inductor.