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1. (WO2017033935) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
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Pub. No.: WO/2017/033935 International Application No.: PCT/JP2016/074532
Publication Date: 02.03.2017 International Filing Date: 23.08.2016
IPC:
H01B 1/22 (2006.01) ,C09J 9/02 (2006.01) ,C09J 11/04 (2006.01) ,C09J 201/00 (2006.01) ,H01B 1/00 (2006.01) ,H01B 5/16 (2006.01) ,H01R 11/01 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
16
comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
定永 周治郎 SADANAGA, Shuujirou; JP
永田 麻衣 NAGATA, Mai; JP
伊藤 将大 ITOU, Masahiro; JP
久保田 敬士 KUBOTA, Takashi; JP
石澤 英亮 ISHIZAWA, Hideaki; JP
夏井 宏 NATSUI, Hiroshi; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2015-16521424.08.2015JP
Title (EN) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
(FR) MATÉRIAU CONDUCTEUR, ET STRUCTURE DE CONNEXION
(JA) 導電材料及び接続構造体
Abstract:
(EN) Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width and the electrode pitch are reduced. The electroconductive material according to the present invention: contains, on the outer surface portion of an electroconductive part, a heat-curable compound, an acid anhydride heat curing agent, and a plurality of electroconductive particles having solder; and exhibits a viscosity at 50°C of 10-200 Pa•s.
(FR) L’invention concerne un matériau conducteur dans lequel une soudure peut être placée de façon sélective dans des particules conductrices sur une électrode, et dans lequel, même si la largeur d’électrode et l’espacement entre les électrodes sont peu importants, la migration peut être empêchée et une faible résistance de connexion maintenue. Dans une partie surface externe d’une partie conductrice, le matériau conducteur selon l’invention contient: plusieurs particules conductrices présentant une soudure; un composé thermodurcissable; et un durcisseur d’anhydride d'acide. La viscosité de ce matériau conducteur à 50℃ est comprise entre 10Pa.s. et à 200Pa.s.
(JA) 電極上に導電性粒子におけるはんだを選択的に配置することができ、かつ、電極幅及び電極間幅が狭くても、マイグレーションを抑制して、接続抵抗を低く維持することができる導電材料を提供する。 本発明に係る導電材料は、導電部の外表面部分に、はんだを有する複数の導電性粒子と、熱硬化性化合物と、酸無水物熱硬化剤とを含み、50℃での粘度が10Pa・s以上、200Pa・s以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)