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1. (WO2017033934) CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Pub. No.:    WO/2017/033934    International Application No.:    PCT/JP2016/074531
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01B 1/22
H01B 1/00
H01B 5/16
H01L 21/60
H01R 4/04
H01R 11/01
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: NAGATA, Mai
永田 麻衣
SADANAGA, Shuujirou
定永 周治郎
ITOU, Masahiro
伊藤 将大
KUBOTA, Takashi
久保田 敬士
ISHIZAWA, Hideaki
石澤 英亮
Title: CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Abstract:
Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermosetting component, and when difference scanning calorimetry is performed by heating the conductive particles and the thermosetting component at a temperature increase rate of 25-10°C/min, a temperature region indicating an endothermic peak derived from melting of the solder in the conductive particles and a temperature region indicating a exothermic peak derived from curing of the thermosetting component at least partially overlap each other.