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|1. (WO2017033934) CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
|Applicants:||SEKISUI CHEMICAL CO., LTD.
|Title:||CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
Provided is a conductive material capable of improving conduction reliability by selectively disposing solder in conductive particles on an electrode. This conductive material includes, in an outer surface section of a conductive part, a plurality of conductive particles having solder, and a thermosetting component, and when difference scanning calorimetry is performed by heating the conductive particles and the thermosetting component at a temperature increase rate of 25-10°C/min, a temperature region indicating an endothermic peak derived from melting of the solder in the conductive particles and a temperature region indicating a exothermic peak derived from curing of the thermosetting component at least partially overlap each other.