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1. (WO2017033933) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Pub. No.:    WO/2017/033933    International Application No.:    PCT/JP2016/074530
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01B 1/22
C09J 9/02
C09J 11/04
C09J 201/00
H01B 1/00
H01B 5/16
H01R 11/01
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: SADANAGA, Shuujirou
定永 周治郎
NAGATA, Mai
永田 麻衣
ITOU, Masahiro
伊藤 将大
KUBOTA, Takashi
久保田 敬士
ISHIZAWA, Hideaki
石澤 英亮
NATSUI, Hiroshi
夏井 宏
Title: ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Abstract:
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity can be made more reliable, and the dimensions of the cured electroconductive material can be made more stable. The electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part: a plurality of electroconductive particles that have solder; a heat-curable component; and an inorganic filler having a degree of hydrophobization of 40 or more, the viscosity of the electroconductive material at 50°C being 10-200 Pa·s.